HFCL and MediaTek Collaboration Boosts Last-Mile 5G Connectivity Solutions for Indian Telcos

HFCL and MediaTek Collaboration Boosts Last-Mile 5G Connectivity Solutions for Indian Telcos

Technology enterprise and communications solution provider HFCL Limited teamed up with chip manufacturer MediaTek on Tuesday to integrate its chipset with the indoor 5G solution and assist telecom operators in addressing last-mile connectivity issues to further the government’s vision of building a sustainable telecom ecosystem. Thanks to the MediaTek T750 chipset, HFCL’s 5G FWA Indoor CPE has features such as an incredibly small form factor and low power consumption. The business released a statement on the fringes of “MWC 2024” in Barcelona, Spain, stating that the 7nm small chipset is outfitted with a 5G radio and quad-core Arm CPU, guaranteeing smooth communication across many devices with dual-band 4×4 Wi-Fi 6 compatibility.

According to Mahendra Nahata, Managing Director of HFCL, “The HFCL 5G FWA Indoor CPE helps telecom operators address the last-mile connectivity challenges in an ultra-compact form factor and provides a fiber-like experience to both consumers and enterprises.”

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The inbuilt eSIM in the HFCL 5G system allows for high-speed data transfer through a 2.5 Gbps Ethernet port. According to the company, it is a plug-and-play gadget with AI-integrated smartphone software that facilitates easy self-installation and aids in determining the optimal signal placement. According to Evan Su, General Manager of MediaTek’s Wireless Communications, “This partnership is another endeavor to support the Indian government’s vision of creating a sustainable telecom ecosystem by promoting local manufacturing.”

“Our modem offers complete functionality, empowering device manufacturers to develop high-performance CPE products in the smallest yet most effective form factors, propelling their vision,” Su continued. Industry projections state that by 2030, the global market for 5G last-mile equipment will have grown to a value of $68 billion.